Interlock device with stamped lead frame
US6817262B2 · kind B2 · utility
1Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Apr 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20104
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
An interlock device includes a housing and a toggle interlock mechanism with an extendable interlock pin. The interlock device also includes a preassembled switch, an electromechanical device, and a lead frame interconnecting the switch and electromechanical device. The lead frame conductors are formed as one piece, but are separated after assembly into the housing. The conductors and mating components include mating non-releasable contacts that telescope together in a manner that forms a robust assembly and that facilitates automation of the assembly process. A method related to the above is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.