Apparatus having forced fluid cooling and pin-fin heat sink
US6817405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jun 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.