Polishing pad and method of use thereof
US6817926B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2003 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jun 19, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of chemically modifying a wafer suited for fabrication of semiconductor devices includes a) contacting a surface of wafer with an article that includes a plurality of unit cells repeating across the surface of the article, the individual unit cells including at least a portion of a three-dimensional structure and being characterized by a unit cell parameter as follows:[[V1−Vs]/Aas]/Auc>5where V1 is the volume defined by the area of the unit cell and the height of the structure of the unit cell, Vs is the volume of the structure of the unit cell, Aas is the apparent contact area of the structure of the unit cell, and Auc is the area of the unit cell, and b) moving at least one of the wafer and the article relative to each other in the presence of a polishing composition that is chemically reactive with a surface of the wafer and capable of either enhancing or inhibiting the rate of removal of at least a portion of the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.