Patent · US Expired

Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof

US6818059B2 · kind B2 · utility

2Cited by
3References
34Claims
0Family size

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Key dates

Filing dateJul 9, 1999
Grant dateNov 16, 2004
Priority date
Expiry dateJul 9, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T117/1008
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention is related to a method of crystallizing an amorphous silicon layer and a crystallizing apparatus thereof which crystallize an amorphous silicon layer using plasma. The present invention includes the steps of depositing an inducing substance for silicon crystallization on an amorphous silicon layer by plasma exposure, and carrying out annealing on the amorphous silicon layer to the amorphous silicon layer. The present invention includes a chamber having an inner space, a substrate support in the chamber wherein the substrate support supports a substrate, a plasma generating means in the chamber wherein the plasma generating means produces plasma inside the chamber, and a heater at the substrate support wherein the heater supplies the substrate with heat.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.