Patent · US Expired

Hot-melt adhesive of low viscosity

US6818093B1 · kind B1 · utility

17Cited by

24References

12Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Eduard Franciscus Taal · Goldkronach, DE
Ruediger Voss · Goldkronach, DE
Heike Eisfeld · Goldkronach, DE

Key dates

Filing date	Jan 29, 2002
Grant date	Nov 16, 2004
Priority date	—
Expiry date	Jan 29, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2883
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention relates to a low-viscosity hotmelt adhesive containing A) at least one hydrocarbon resin solid at 20° C. with a softening temperature of 70 to 140° C., B) at least one oil with an average molecular weight of >500 and preferably C) a styrene block copolymer. The new hotmelt adhesive is distinguished by a melt viscosity of essentially only 500 to 3200 mPas at 150° C. for a softening temperature of 60 to 115° C. It is preferably used in the field of hygiene for bonding films, nonwovens and/or shaped articles of cellulose derivatives, being distinguished by particular resistance to dermatologically compatible coatings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.