Fabrication of electronic magnetic, optical, chemical, and mechanical systems using chemical endpoint detection
US6818137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jan 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30604
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system that facilitates construction of electromagnetic, optical, chemical, and mechanical systems using chemical endpoint detection. The system operates by receiving a system description that specifies multiple components, including a first component and a second component. The system fabricates the first component and the second component using selected construction materials. The system also creates a first interconnection structure on the first component and a second interconnection structure on the second component. These interconnection structures can be created using a sacrificial layer and chemical endpoint detection. Next, the system brings the first component and the second component together by connecting the first interconnection structure and the second interconnection structure. These interconnection structures align the first component to the second component so that accurate alignment can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.