Resilient flooring structure with encapsulated fabric
US6818282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Nov 7, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/387
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laminated fabric floor product having an encapsulated fabric scrim within a vinyl resilient flooring structure. The laminated fabric floor product structure includes a PVC calendered base, a first hot melt film, a fabric, a second hot melt film, a calendered clear film, and a high performance coating. Traditional foamed and non-foamed substrates used in the flooring industry can be used in addition to the calendered base. All types of fabrics and scrims can be encapsulated. The fabrics can be both woven and non-woven types. Open scrims can be used with base layers that are printed or have a visual pattern so that design features and colors can be seen through the open areas of the scrim. The fabric layer can be printed with a design pattern and adhered to the base layer or substrate by the first hot melt adhesive film layer. The clear layer is adhered to the fabric layer by the second hot melt adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.