Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
US6818469B2 · kind B2 · utility
35Cited by
11References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2003 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film capacitor is provided with a substrate having a thickness equal to or more than 2 &mgr;m and equal to or less than 100 &mgr;m; a lower electrode on the substrate, which includes at least a highly elastic electrode and an anti-oxidation electrode on the highly elastic electrode; a dielectric thin film on the first lower electrode; and an upper electrode on the dielectric thin film; wherein the highly elastic electrode is made of a material having a Young's modulus higher than that of the anti-oxidation electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.