Heat dissipating silicon-on-insulator structures
US6818817B2 · kind B2 · utility
33Cited by
20References
50Claims
0Family size
Inventor
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat dissipating Silicon-on-Insulator (SOI) structures which utilize thermoelectric effects to more effectively dissipate thermal energy from SOI-based electronic circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.