Magnetic head with lower coil traces connected to integrally formed vertical interconnects and upper coil traces through plural insulating layer arrangement
US6819527B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2000 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Mar 23, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A magnetic head having a helical induction coil. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.