Dielectric structure
US6819540B2 · kind B2 · utility
19Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Oct 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0773
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.