Method of cutting a laminated web and reducing delamination
US6820784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Dec 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/329
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for cutting a laminated web including the steps of engaging a first side of the laminated web with a crack initiator having a high rake angle, the crack initiator extending from a first cutter base having a low rake angle, the laminated web including at least a support web, and an upper layer that may, at least for imaging elements, be considered a protective layer, the upper layer being thinner than the support web, the upper layer being located at the first side of the laminated web structure; simultaneously engaging a second side of the laminated web with a second cutter, the second cutter being offset from the first cutter; generating a first crack in the first side of the laminated web with the crack initiator completely through the upper layer; engaging the web with the cutter base of the first cutter; and further propagating the first crack beyond the tip of the first crack initiator using the cutter base, whereby the tip of the first crack initiator is disengaged from the laminated web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.