Diamond compact

US6821188B2 · kind B2 · utility

Inventors

• Klaus Tank · Germiston, ZA
• Noel J. Pipkin · Randburg, ZA
• Johan Myburgh · Benoni, ZA

Key dates

• Filing date: Apr 30, 2003
• Grant date: Nov 23, 2004
• Expiry date: Apr 30, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B22F2998/00
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

There is disclosed a method of abrading a product where a corrosive environment is experienced which includes the steps of using, as the abrading element, a composite diamond compact comprising a diamond compact bonded to a cemented carbide substrate, the diamond compact comprising a polycrystalline mass of diamond particles and a second phase containing diamond catalyst/solvent and a noble metal.