In-line deposition processes for circuit fabrication
US6821348B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Oct 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/466
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or portions of layers, of the circuit. A deposition substrate can also be formed from an elongated web, and the deposition substrate web can be fed through a series of deposition stations. Each deposition station may have an elongated web formed with aperture mask patterns. The elongated web of mask patterns feeds in a direction perpendicular to the deposition substrate web. In this manner, the circuit creation process can be performed in-line. Moreover, the process can be automated to reduce human error and increase throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.