Tool for thermo-compression-bonding chips, and chip packaging device having the same
US6821381B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2003 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jul 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic presser 5 being sintered. In addition) the coefficient of linear expansion of the ceramic holder 2 is approximately equal to those of the ceramic heater 4 and ceramic presser 5; furthermore, the thermal conductivities of the ceramic holder 2 and ceramic presser 5 are greater as the pressure side of the ceramic presser 5 as seen from the ceramic heater 4 is approached and are smaller as the attaching surface side of the ceramic holder 2 is approached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.