Substrate and method of forming substrate for fluid ejection device
US6821450B2 · kind B2 · utility
5Cited by
20References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2003 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jan 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.