Patent · US Expired

Non-thermal plasma reactor substrate design-E-shape with low loss electrode pattern

US6821493B2 · kind B2 · utility

4Cited by
10References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 28, 2002
Grant dateNov 23, 2004
Priority date
Expiry dateJan 12, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05H2245/17
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

A low-loss electrode-printed structural dielectric barrier for a non-thermal plasma reactor and non-thermal plasma multi-cell stacks having low-loss electrodes. The low-loss electrode-printed structural dielectric barriers include a structural dielectric barrier having a first side and a second opposite side; a low-loss electrode pattern disposed on the second side of the structural dielectric barrier; the low-loss electrode pattern comprising first and second major electrode sections that are offset from any ribs, supports, ligaments, spacers, tines, or other structure that serves as a structural dielectric connection between dielectric barriers in a multi-cell stack, a connector disposed between and electrically connecting the first and second major electrode sections and offset relative to a centerline perpendicular to the rib orientation, and a bus path connector electrically connected to one of the major electrode sections and offset relative to the centerline.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.