Solvent-free thermosetting resin composition, process for producing the same, and product therefrom
US6821657B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Sep 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.