Patent · US Expired

Kind of thin films for microsystem technology and microstructuring and their use

US6821692B1 · kind B1 · utility

2Cited by
19References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 4, 1999
Grant dateNov 23, 2004
Priority date
Expiry dateFeb 4, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02282
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention relates to novel thin layers for microsystem techniques and microstructuring. It is an object of the invention to provide thin layers which can be manufactured under less problems and more economically than the previous conventional layers, and which permit the use of existing technologies for microstructuring. The object is realized in that the thin layer is formed of an enzymatically degradable biopolymer in a range of layer thicknesses of from 30 nm to 3 &mgr;m. Biopolymeric thin layers manufactured according to the invention permit their application, after a respective structurizing, as test assays or in setting up substance libraries.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.