Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation
US6821910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2003 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jan 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multizone, segmented showerhead provides a gas impingement flux distribution which is controllable in two lateral dimensions to achieve programmable uniformity in chemical vapor deposition, in plasma deposition and etching and other processes. Recirculation (pumping) of exhaust gases back through the showerhead reduces intersegment mixing to achieve a high degree of spatial control of the process. This spatial control of the impinging gas flux distribution assures that uniformity can be achieved at process design points selected to optimize materials performance. Spatial control also permits rapid experimentation by enabling the introduction of intentional nonuniformities so that combinatorial data from across the wafer/substrate provides results of simultaneous experiments at different process design points. This ability is useful for process tuning and optimization in manufacturing or for rapid materials and process discovery and optimization in research and development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.