Patent · US Expired

Use of reactive phenolic resins in the preparation of highly viscous self-adhesive compositions

US6822029B1 · kind B1 · utility

5Cited by

9References

16Claims

0Family size

Assignee

tesa AG · DE

Inventors

Axel Burmeister · Hamburg, DE
Sven Hansen · Hamburg, DE
Heiko Leydecker · Neustadt, DE
Christian Kreft · Hamburg, DE
Jochen Stähr · Hannover, DE

Key dates

Filing date	Aug 18, 2000
Grant date	Nov 23, 2004
Priority date	—
Expiry date	Mar 10, 2021

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2666/16
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Hot-melt pressure-sensitive adhesive based one or more non-thermoplastic elastomers, at least comprising 100 parts by mass of the non-thermoplastic elastomer(s), from 1 to 200 parts by mass of one or more tackifying resins, from 1 to 100 parts by mass of one or more reactive phenolic resins whose methylol content is from 1 to 20% by weight, based on the reactive phenolic resin, from 1 to 100 parts by mass of accelerator substances.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.