Patent · US Expired

Method for producing a trench structure in a polymer substrate

US6822191B2 · kind B2 · utility

16Cited by

5References

26Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hubert De Steur · Drongen, BE
Stefan Lesjak · Ettlingen, DE
Wei Pan · Evergem, BE

Key dates

Filing date	Mar 5, 2003
Grant date	Nov 23, 2004
Priority date	—
Expiry date	May 12, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/108
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

In order to produce a trench structure having steep sidewalls free of residues in an, in particular, glass-fiber-reinforced substrate, the substrate is provided with a conformal mask having cutouts corresponding to the trench structure to be produced. In this case, the laser beam is guided over the cutouts of the mask in such a way that the low-energy edge regions of the laser beam are shielded and that proportion of the laser beam which impinges on the polymer surface, at each point, has an energy density above a threshold at which the substrate material including a glass fiber reinforcement that is possibly present is completely removed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.