Stabilizers for electroless plating solutions and methods of use thereof
US6824597B2 · kind B2 · utility
10Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.