Hard film for cutting tools, cutting tool coated with hard film, process for forming hard film, and target used to form hard film
US6824601B2 · kind B2 · utility
77Cited by
15References
14Claims
0Family size
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Key dates
| Filing date | Dec 26, 2001 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Dec 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12785
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A hard film for cutting tools which is composed of(Ti1−a−b−c−d, Ala, Crb, Sic, Bd)(C1−aNe) 0.5≦a≦0.8, 0.06≦b, 0≦c≦0.1, 0≦d≦0.1, 0≦c+d≦0.1, a+b+c+d<1, 0.5≦e≦1(where a, b, c, and d denote respectively the atomic ratios Al, Cr, Si, and B, and e denotes the atomic ratio of N.)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.