Single wafer type substrate cleaning method and apparatus
US6824621B2 · kind B2 · utility
13Cited by
4References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2001 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | May 19, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.