Method and device of peeling semiconductor device using annular contact members
US6824643B2 · kind B2 · utility
63Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Jun 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged one after another from the outside to the inside, and the annular contact members are operated so that the semiconductor chip is successively peeled from the tape from the outer circumferential portion thereof toward the central portion thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.