Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same
US6824888B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Oct 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.