Integrated circuit-integrated flexible shear-stress sensor skin and method of fabricating the same
US6825539B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2003 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Mar 31, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An IC-integrated, flexible, shear-stress sensor skin is made by providing a wafer with integrated circuits and sensor elements which are fabricated in the wafer, disposing a first polymer layer on the wafer and sensor elements to provide mechanical support for the sensor elements, defining a cavity below the sensor elements to provide thermal isolation, while the sensor element remains supported by the first polymer layer, and isolating the sensor elements into a plurality of islands defined in the wafer, so that the islands, with at least one sensor element on at least one of the islands, and the integrated circuits form the IC-integrated, flexible, shear-stress sensor skin. The invention is an IC-integrated, flexible, sensor skin made according to the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.