Solder filler
US6825560B1 · kind B1 · utility
30Cited by
2References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2003 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | May 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to electrically attaching a surface mount device to mounting structure via their respective contact pads using an attach material, such as solder or conductive epoxy, which includes a filler material. In general, the filler material is relatively solid and granular shaped, wherein the diameter of the filler material controls a mounting distance between the surface mount device and the mounting structure. The filler allows a desired distance to be maintained during initial placement of the surface mount device and any subsequent reheating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.