Thermal control of a DUT using a thermal control substrate

US6825681B2 · kind B2 · utility

Assignee

• Delta Design, Inc. · US

Inventors

• Jan Feder · Westerville, US
• Rick Beyerle · Columbus, US
• Stephen Byers · Dublin, US
• Thomas P. Jones · Escondido, US

Key dates

• Filing date: Jul 19, 2002
• Grant date: Nov 30, 2004
• Expiry date: Aug 14, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67248
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.