Methods for positioning and bonding elements in substrates
US6826928B2 · kind B2 · utility
4Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.