Parallel-plate heat pipe apparatus having a shaped wick structure
US6827134B1 · kind B1 · utility
21Cited by
27References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | May 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.