Packaging container for electronic components
US6827218B1 · kind B1 · utility
10Cited by
28References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Aug 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging container for electronic components, particularly integrated circuits, which includes a tray into which the integrated circuits can be secured, a tray cover which is secured onto the tray, wherein the tray cover is composed of a plastic material, a desiccating material and an electrostatic dissipating product. The tray cover may further include a humidity indicating system incorporated into the tray cover. The packaging container may also be placed within a water and moisture-proof barrier bag for shipment purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.