Butt joined electronic assembly and module having an electrical standoff
US6827504B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements. The standoff dielectric substrate is positioned in an abutting relationship with one of the electrical elements. The standoff dielectric substrate and the first and second electrical elements are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.