Modular frame for a wafer fabrication system
US6827546B2 · kind B2 · utility
0Cited by
17References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Jan 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular frame assembly for a wafer fabrication system comprising at least one base casting and at least one upstanding pod door opening casting. The at least one base casting and at least one upstanding pod door opening casting are self registering and allow frames for wafer fabrication systems of any normally desired configuration to be produced out of a small number of cast modules. More specifically, in a preferred embodiment, frames configured to mate with one to four commercially available loaders may be readily assembled out of the aluminum castings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.