Non-cyanide copper plating process for zinc and zinc alloys
US6827834B2 · kind B2 · utility
2Cited by
8References
22Claims
0Family size
Inventors
Key dates
| Filing date | Mar 12, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Mar 12, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is then electroplated with a copper pyrophosphate solution. The method produces an adherent copper coating on the zinc or zinc alloy, which can be deformed without any loss of the copper coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.