Device and method for core buildup using a separator
US6828215B2 · kind B2 · utility
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1References
33Claims
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Key dates
| Filing date | Mar 17, 2003 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Mar 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device and method to manufacture two substrates simultaneously using a separator. The separator is sandwiched between two cores and adhesive is used to affix to the first core to the second core. Layers are affixed to the first core and the second core simultaneously. The cores are then separated and the separator removed to form two substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.