Manufacturing method for wiring circuit substrates
US6828221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | May 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention prepares a member having a conductor-circuit-forming copper foil formed on a protrusion-forming copper layer via an etching-barrier layer formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil by using etchant that does not etch the etching-barrier layer, and protrusions are thereby formed. Then, the etching-barrier layer is removed using etchant that does not etch the copper foil and using the protrusions as masks. An interlayer-insulating layer is formed on a surface of the copper foil, on which the protrusions are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.