Flip chip package structure for an image sensor and an image sense module with the flip chip package structure
US6828543B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Sep 16, 2003 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Sep 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sense module includes a semi-conductor image sense chip having a top face attached to a bottom face of a glass plate and multiple electric contacts formed on the semi-conductor image sense chip. A conductive interconnection circuit is formed on the bottom face of the glass plate. The conductive interconnection circuit has multiple first solder points each electrically connected to a corresponding one of the electric contacts of the semi-conductor image sense chip and multiple second solder points formed on one side of the glass plate. A lens set is secured on the glass plate. The lens set includes a holder perpendicularly attached to a top face of the glass plate and having a skirt downward extending from the holder. A channel is defined in one side of the skirt for allowing the conductive interconnection circuit extending through the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.