Modular cooling system and thermal bus for high power electronics cabinets
US6828675B2 · kind B2 · utility
116Cited by
14References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Mar 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.