Patent · US Expired

Method for producing a structural member from plates stacked on top of each other and soldered together

US6829824B2 · kind B2 · utility

7Cited by

8References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Wilfried Reschnar · Schozach, DE
Stephan Borges · Ludwigsburg, DE
Stephan Leuthner · Leonberg, DE
Juergen Hackenberg · Sachsenheim, DE
Franz Wetzl · Mundelsheim, DE

Key dates

Filing date	May 8, 2003
Grant date	Dec 14, 2004
Priority date	—
Expiry date	May 8, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49369
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.