Patent · US Expired

Sensor device for registering strain

US6829945B2 · kind B2 · utility

4Cited by

7References

17Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Markus Gilch · Moosburg an der Isar, DE
Anton Grabmaier · Bietigheim-Bissingen, DE
Leif Reinhold · Regensburg, DE

Key dates

Filing date	Jul 17, 2002
Grant date	Dec 14, 2004
Priority date	—
Expiry date	Jul 17, 2022

Classification

Technology area (CPC G)Physics
CPC primaryG01L3/1457
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor device for registering strain of a component, which comprises a sensor chip and a supporting substrate, which are connected to each other by a connecting layer such that they form a prefabricated sensor module. The sensor module is attached to the component by a durable creep-free connection such that the strain of the component is transferred to the sensor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.