Polishing machine
US6830505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2003 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Aug 25, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.