Method and apparatus for dicing released MEMS wafers
US6830990B1 · kind B1 · utility
15Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Mar 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments are methods and apparatuses for different steps in separating wafers into multiple wafer die. Some embodiments are adapted for dicing wafers having a front side and a back side, where the front side has processed devices, such as MEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.