Thermally conductive sheet
US6831031B2 · kind B2 · utility
18Cited by
1References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Feb 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive sheet comprising boron nitride powder as a first thermally conductive filler dispersed into an organic matrix, wherein the boron nitride powder is hexagonal boron nitride (h-BN), and comprises primary particles and secondary aggregates formed by aggregation of the primary particles, wherein at least part of the secondary aggregates being 50 &mgr;m or more in size. The boron nitride powder preferably includes 1 to 20 percent by weight of secondary aggregates of 50 &mgr;m or more in size. The organic matrix material is preferably silicone rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.