Film adhesives containing maleimide compounds and methods for use thereof
US6831132B2 · kind B2 · utility
33Cited by
6References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Mar 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.