Method for forming a substructure of a multilayered laminate
US6832436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a substructure or an electrical structure. To form the substructure, a sheet of conductive material having exposed first and second surfaces is provided. A hole is formed through the sheet of conductive material. A first layer of dielectric material is applied to the exposed first surface, after the forming the hole. No material was inserted into the hole before applying the first layer of dielectric material to the exposed first surface. To form the electrical structure, a multilayered laminate that includes a plurality of substructures is formed such that a dielectric layer insulatively separates each pair of successive substructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.