Patent · US Expired

Thermoformable polyamides

US6833429B1 · kind B1 · utility

2Cited by

10References

10Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Dirk Pophusen · Leverkusen, DE
Detlev Joachimi · Krefeld, DE
Jurgen Rohner

Key dates

Filing date	Apr 1, 2002
Grant date	Dec 21, 2004
Priority date	—
Expiry date	Apr 1, 2022

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K7/14
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.