Structure comprising an insulated part in a solid substrate and method for producing same
US6833570B1 · kind B1 · utility
0Cited by
9References
7Claims
0Family size
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure having a first part and at least one second part. The second part is electrically insulated from the first part and the parts are formed in the same wafer of a material. The first and second parts have the same thickness, extend in the same plane and have at least one mutually adjacent edge. The adjacent edges are separated by a spacing. In addition there is at least one joint of insulating material arranged in the spacing to make the first and second parts integral. The structure may be used for sensors and isolated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.