Patent · US Expired

Metal gasket for a semiconductor fabrication chamber

US6833621B2 · kind B2 · utility

0Cited by
3References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 10, 2002
Grant dateDec 21, 2004
Priority date
Expiry dateDec 10, 2022

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF05C2201/0475
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A metal gasket for a semiconductor fabrication chamber capable of preventing base plate metal contamination in the chamber, wherein the metal gasket includes a diffusion barrier layer interposed between a base plate and an anti-corrosive coating layer, and wherein the diffusion barrier layer prevents elements of the base plate from being diffused to the anti-corrosive coating layer. Accordingly, the diffusion barrier layer prevents attack on the anti-corrosive coating layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.